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ULA materials

Withthedevelopmentofflipchiptechnology,α-particleinducedsofterrorsaregraduallyincreasing.Underthecurrentpackagingtechnologyandconditions,theuseoflowαsolderisacost-effectivemeasuretoreducet

Low Alpha Solder Ball

Assemiconductorchipsbecomesmallandhighlyintegrated,softerrorsinducedbyαparticlesshouldnotbeignored.Underthecurrentpackagingtechnologyandconditions,usinglowαsolderisaneconomicalandeffective

Liquid metal

Gabasedliquidmetalisprocessedbynon-toxicmetalsGa,In,Sn,Zn,silver,etc.Liquidmetalatroomtemperatureasahighthermalconductivity,deformable,currentandelectromagneticdualcontroloftheflowofmetal,istoreplaces

Micro-coil

Micro-coil

Column With Copper Wrap

Copper coated strip welding post

Ordinary tin pillar

Ordinary tin pillar